10/4/2023 0 Comments Arenas silicas mttyFor this study, three different Cu electrodeposition chemistries were analyzed using Time-of-Flight Secondary Ion Mass Spectroscopy (TOF-SIMS), Focused Ion Beam (FIB), Laser Scanning method, Electron Backscattered Diffraction, and the Nano-indentation techniques. In this study, the role of electrodeposition chemistry on thermo-mechanical behavior of different Cu-films is examined.
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